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Message from the Executive Director

Thank you to everyone who attended the FOA Q3 meeting at SEMICON WEST in San Francisco. It was very well attended and successful. It takes a great deal of time, effort and attention to detail to organize a successful meeting (especially this one!), and my appreciation goes to those responsible. 

Preparation for the Q4 meeting is on track. The meeting will be generously hosted by ON Semiconductor in Gresham, OR on Thursday, October 25, 2018. Invitations for this event were sent last week. Please let Christie Baker know if you did not receive yours.

We, the FOA team at SEMI, look forward to seeing you at the Q4 meeting in October! Please keep tabs on our website to stay up-to-date with the latest news and activities.

Tom Salmon, FOA Executive Director, SEMI

Welcome new FOA Member!
Everspin Technologies
Q3 Meeting Recap

The FOA Q3 event meeting was co-located with SEMICON WEST at the Moscone Center in San Francisco on July 12, 2018. The day started with introductions, powerful and interactive discussions between device makers, followed by a very engaging speed networking session.  

Key highlights:

  • Chris Dieseldorff from IR&S, SEMI provided an overview of the 200mm fabs.
  • The open forum discussion focused on the aging workforce crisis and skilled labor shortages.
    • Several members are putting together a curriculum with their local community colleges to mitigate this issue.
    • SEMI runs a workforce development program to support STEM education and promote career awareness in the areas of semiconductor and high-tech manufacturing and technology.
    • Check out the SEMI Foundation website if you’d like to get involved.
  • Rob Leachman from University of California, Berkeley, the guest speaker for this event, spoke about the “Engineering of Speed”. His pioneering work includes the efforts in reducing compute entitlement cycle time and closing the execution gap at fabs around the world.
  • ePAK graciously sponsored the lunch.
  • The afternoon session saw the most popular feature of the event – “speed networking”. Device makers and solution providers were given ten minutes to speak to each other, moving from table to table like speed dating. The purpose of these short meetings was to create a platform for members to build new business connections. Over 100 such mini-meetings were held with record-setting participation from 10 device makers and 28 solution providers.


Figure 1: Members exploring future trends in the 200mm fab landscape


Figure 2: Device makers and solution providers mingle at the fast-paced networking event

Working Groups Update
  • The Equipment Engineering & Maintenance Management (EE&MM) team has identified Fault Detection and Classification (FDC) as area of high interest amongst the FOA device maker members and will kick off discussions on the topic with a meeting on September 14th. 
  • The Industrial Engineering (IE) group will be meeting face to face at the FOA Q4 meeting at Gresham, Oregon. The team is currently gathering a list of topics for discussion at the event.

Please contact Shilpa Talwalkar if you wish to participate in these groups.

Upcoming Events





OCTOBER 25, 2018